Development of the leadfree active solder and research of material solderability of metallic and ceramic materials with the utilization of ultrasonic activationSupervisor: prof. Ing. Roman Koleňák, PhD.
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|Project description:||The project is focused on the development of a universal lead free solder, aimed for a fluxless environmentally acceptable soldering of metallic and ceramic materials. Clarification of the mechanism of joint creation in case of soldering of ceramic and non-metallic materials with the ulitization of ultrasonic activation. Research of material solderability of ceramic (Al203, SiO2, ITO, TiO2, etc.) and non-metallic (Si, Ge, C) materials, of a high or technical purity, with the same kind or in combination with metals (Al, Mg, Ti, Cr, Co, Mo, Ni, Cu, Zr, Hf, Ta, W, etc.). Influence of the ultrasonic soldering parameters on the solderability and quality properties of joints.|
|Kind of project:||APVV ()|
|Department:||Institute of Production Technologies (MTF)|
|Project status:||Successfully completed|
|Project start date :||01. 01. 2005|
|Project close date:||31. 12. 2007|
|Number of workers in the project:||2|
|Number of official workers in the project:||2|
The following table shows the researcher workers who have been assigned official roles in a project.
|prof. Ing. Roman Koleňák, PhD.||zodpovedný riešiteľ|
|Mária Rešetková, MBA||administratíva|