May 24, 2019   7:47 a.m. Ela
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Research of low tempereture packaging materials and laser soldering technology for advanced electronic manufacturing

Supervisor: prof. Ing. Roman Koleňák, PhD.

Basic information   Workers      

This page shows details on the project. The primary projects are displayed together with a list of sub-projects.

Project description:The project deals with the composition design, preparation technology and performance characterization of the new low temperature package solder. Based on the effect of reducting the melting point of nano-particles, nanocomposite packaging solder with small size and uniform size will be prepared by liquid phase reduction method by adding active rare earth nanoparticles into lead-free solder. The research focused to the solderability of nanocomposites on diffusion and dissolution of interface elements under the action of ultrasonic energy field will be mainly studied. The physical and mechanical mechanisms of interface structure and metallurgical bonding between ceramic and solder alloys under ultrasonic energy field will be revealed.
Kind of project:APVV - Bilaterálna spolupráca ()
Department:Institute of Production Technologies (MTF)
Project identification:SK-CN-RD-18-0019
Project status:Not approved
Project start date :01. 10. 2018
Project close date:14. 06. 2021
Number of workers in the project:12
Number of official workers in the project:11

Official project workers

The following table shows the researcher workers who have been assigned official roles in a project.

OfficerOfficial roles
prof. Ing. Roman Koleňák, PhD.zodpovedný riešiteľ
Mária Rešetková, MBAadministratíva
Ing. Jozef Bárta, PhD.spoluriešiteľ
doc. Ing. Erika Hodúlová, PhD.spoluriešiteľ
Ing. Igor Kostolný, PhD.spoluriešiteľ
doc. Dr. Ing. Pavel Kovačócyspoluriešiteľ
Ing. Ingrid Kovaříková, PhD.spoluriešiteľ
prof. Ing. Milan Marônek, CSc.spoluriešiteľ
Ing. Miroslav Sahul, PhD.spoluriešiteľ
Ing. Beáta Šimeková, PhD.spoluriešiteľ
Ing. Ján Urminský, PhD.spoluriešiteľ