Feb 28, 2020   10:14 a.m. Zlatica
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Final theses


Basic information

Basic information about a final thesis

Type of thesis: Diploma thesis
Thesis title:The role of fluxes in low-temperature soldering with lead free solders
Written by (author): Ing. Tomáš Gábor
Department: Institute of Production Technologies (MTF)
Thesis supervisor: prof. Ing. Milan Turňa, PhD.
Opponent:prof. Ing. Ján Lokaj, PhD.
Final thesis progress:Final thesis was successfully defended.


Additional information

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Language of final thesis:Slovak

Slovak        English

Title of the thesis:The role of fluxes in low-temperature soldering with lead free solders
Summary:The presented thesis deals with at present very topical issue of importance of fluxes in soldering with the lead free solders. The work consists of a theoretical and an experimental part. The theoretical part presents a summary of knowledge from the field of research and application of soldering destined mainly in the spheres of electrotechnics and electronics. In the industrially advanced countries of the word, there is known a great number of patented alloys destined for soldering with lead free solders. However, these solders necessitate to assign a suitable flux, in order that the soldering process would be successful and the fabricated joints would attain the desired properties. The aim of experimental part was to approve the soldering properties of fluxes assigned to actual solders. Four types of fluxes in total were studied: X33S-07i, SLS 65, JS-EU-01 and colophony. The solders with following composition were selected: SnAg3,5, SnAg0,3Cu0,7 a SnAg3,5Cu0,7. Soldering was performed in agreement with the valid STN standard. Heating was assured in a muffle furnace with measurement of soldering temperature by use of thermocouples. The quality of metallurgical bonding of individual solders with a Cu substrate was assessed with conventional procedures by use of optical microscopy and microhardness measurement. A more detailed study of joint boundary was performed by EDX microanalysis, whereas also diffusion curves for individual elements and Cu substrate were plotted. The combination of SnAg3,5 solder with colophony flux was assessed as the best one. The importance of suitable fluxes for more demanding soldering processes and the desired utility properties of joints fabricated with the lead free solders was emphasised.
Key words:soldering, spreadability, copper, flux, solder, wettability

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